Test Capability

Electrical Testing

  • Digital IC Testing
  • Linear IC Testing
  • Discrete Component Testing
  • Passive Component Testing
  • Hybrid Testing
  • RF Testing
  • Temperature Testing

Burn-in

  • MIL-STD-883
  • MIL-STD-750
  • Static and Dynamic
  • Operating Life
  • Non-operating Life

Environmental Testing

  • Humidity/Moisture Resistance
  • Temperature Cycling (air to air)
  • Thermal Shock (liquid to liquid)
  • HAST
  • Stabilization Bake

Component Services

  • Tinning/Hot Solder Dip
  • Tape and Reel
  • Prom/EPROM/PAL Programming
  • Marking
  • Packaging
  • Buy and Sell Services

Physical Analysis

  • Destructive Physical Analysis
  • X-ray
  • Internal Visual
  • External Visual
  • Bond Pull
  • Die Shear
  • Lid Torque
  • Lead Integrity
  • Terminal Strength
  • Scanning Electron Microscopy (SEM)
  • Cross-sectioning
  • Construction Analysis
  • Internal Water Vapor*

Mechanical Testing

  • PIND
  • Fine Leak
  • Gross Leak
  • Marking Permanency
  • Physical Dimensions
  • Solderability
  • External Visual
  • Vibration*
  • Shock
  • Salt Atmosphere*

Test Methods

  • MIL-STD-883
  • MIL-PRF-19500
  • MIL-PRF-38535
  • MIL-STD-38510
  • MIL-PRF-38534

tester-10992555
CB-tall-7596025