Electrical Testing
- Digital IC Testing
- Linear IC Testing
- Discrete Component Testing
- Passive Component Testing
- Hybrid Testing
- RF Testing
- Temperature Testing
Burn-in
- MIL-STD-883
- MIL-STD-750
- Static and Dynamic
- Operating Life
- Non-operating Life
Environmental Testing
- Humidity/Moisture Resistance
- Temperature Cycling (air to air)
- Thermal Shock (liquid to liquid)
- HAST
- Stabilization Bake
Component Services
- Tinning/Hot Solder Dip
- Tape and Reel
- Prom/EPROM/PAL Programming
- Marking
- Packaging
- Buy and Sell Services
Physical Analysis
- Destructive Physical Analysis
- X-ray
- Internal Visual
- External Visual
- Bond Pull
- Die Shear
- Lid Torque
- Lead Integrity
- Terminal Strength
- Scanning Electron Microscopy (SEM)
- Cross-sectioning
- Construction Analysis
- Internal Water Vapor*
Mechanical Testing
- PIND
- Fine Leak
- Gross Leak
- Marking Permanency
- Physical Dimensions
- Solderability
- External Visual
- Vibration*
- Shock
- Salt Atmosphere*
Test Methods
- MIL-STD-883
- MIL-PRF-19500
- MIL-PRF-38535
- MIL-STD-38510
- MIL-PRF-38534